Assemblies and methods for dissipating heat from handheld electronic devices

ABSTRACT

According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device&#39;s battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 12/479,284, filed Jun. 5, 2009 (which will issue as U.S. Pat.No. 7,965,514 on Jun. 21, 2011). The entire disclosures of theaforementioned patent are incorporated herein by reference in theirentirety.

FIELD

The present disclosure generally relates to assemblies and methods fordissipating heat from handheld electronic devices or other electronicdevice, by a thermally-conducting heat path that includes or is formedby one or more portions of an electromagnetic interference (EMI) boardlevel shield (BLS) and/or thermal interface material (TIM) disposedaround the battery area or battery of the electronic device.

BACKGROUND

This section provides background information related to the presentdisclosure which is not necessarily prior art.

Electronic components, such as semiconductors, transistors, etc.,typically have pre-designed temperatures below which the electroniccomponents optimally operate. Ideally, the pre-designed temperaturesapproximate the temperature of the surrounding air. But the operation ofelectronic components generates heat which, if not removed, will causethe electronic component to operate at temperatures significantly higherthan its normal or desirable operating temperature. Such excessivetemperatures may adversely affect the operating characteristics of theelectronic component and the operation of the associated device. Toavoid or at least reduce the adverse operating characteristics from theheat generation, the heat should be removed, for example, by conductingthe heat from the operating electronic component to a heat sink. Theheat sink may then be cooled by conventional convection and/or radiationtechniques. During conduction, the heat may pass from the operatingelectronic component to the heat sink either by direct surface contactbetween the electronic component and heat sink and/or by contact of theelectronic component and heat sink surfaces through an intermediatemedium or thermal interface material (TIM). The thermal interfacematerial may be used to fill the gap between thermal transfer surfaces,in order to increase thermal transfer efficiency as compared to havingthe gap filled with air, which is a relatively poor thermal conductor.In some devices, an electrical insulator may also be placed between theelectronic component and the heat sink, in many cases this is the TIMitself.

In addition, electronic equipment, devices, components, parts, etc.generate undesirable electromagnetic energy that can interfere with theoperation of proximately located electronic equipment. Such EMIinterference may adversely affect the operating characteristics of theelectronic component and the operation of the associated device.Accordingly, it is not uncommon to provide shielding and/or groundingfor electronic components that use circuitry that emits or issusceptible to electromagnetic interference. These components may beshielded to reduce undesirable electromagnetic interference and/orsusceptibility effects with the use of a conductive shield that reflectsor dissipates electromagnetic charges and fields. Such shielding may begrounded to allow the offending electrical charges and fields to bedissipated without disrupting the operation of the electronic componentsenclosed within the shield. By way of example, sources of undesirableelectromagnetic energy are often shielded by a stamped metal enclosure.

As used herein, the term electromagnetic interference (EMI) should beconsidered to generally include and refer to both electromagneticinterference (EMI) and radio frequency interference (RFI) emissions. Theterm “electromagnetic” should be considered to generally include andrefer to both electromagnetic and radio frequency from external sourcesand internal sources. Accordingly, the term shielding (as used herein)generally includes and refers to both EMI shielding and RFI shielding,for example, to prevent (or at least reduce) ingress and egress of EMIand RFI relative to a shielding device in which electronic equipment isdisposed.

SUMMARY

This section provides a general summary of the disclosure, and is not acomprehensive disclosure of its full scope or all of its features.

According to various aspects of the present disclosure, exemplaryembodiments include assemblies and methods for dissipating heat from anelectronic device by a thermally-conducting heat path to the externalcasing via one or more portions of an electromagnetic interferenceshield and/or thermal interface material disposed around the device'sbattery or other power source. In an exemplary embodiment, a thermallyconductive structure which comprises elastomer may be disposed about ordefine a battery area such that heat is transferable to the externalcasing by a thermally-conductive heat path around the battery areathrough or along the thermally conductive structure which compriseselastomer.

In another exemplary embodiment, an electronic device includes anexterior casing and a circuit board including one or more heatgenerating components. A battery area is between the circuit board andthe exterior casing. An electromagnetic interference (EMI)shielding/thermal interface material is positioned relative to the oneor more heat generating components to provide EMI shielding to the oneor more heat generating components. A thermally-conductive heat path isprovided from the one or more heat generating components to the exteriorcasing. The thermally-conductive heat path includes a portion around thebattery area that is defined by one or more portions of theelectromagnetic interference (EMI) shielding/thermal interface material,such that heat is transferable along the thermally-conductive heat pathand portion thereof around the battery area.

Additional aspects of the present disclosure include methods relating toheat dissipation with thermally-conductive heat paths within electronicdevices. In an exemplary embodiment, a method generally includespositioning a thermally conductive structure which comprises elastomerto establish a thermally-conductive heat path around a battery areabetween an exterior casing and a circuit board of the electronic device.The thermally-conductive heat path may allow heat transfer from one ormore heat generating components on the circuit board within theelectronic device to the exterior casing.

Further aspects and features of the present disclosure will becomeapparent from the detailed description provided hereinafter. Inaddition, any one or more aspects of the present disclosure may beimplemented individually or in any combination with any one or more ofthe other aspects of the present disclosure. It should be understoodthat the detailed description and specific examples, while indicatingexemplary embodiments of the present disclosure, are intended forpurposes of illustration only and are not intended to limit the scope ofthe present disclosure.

DRAWINGS

The drawings described herein are for illustrative purposes only ofselected embodiments and not all possible implementations, and are notintended to limit the scope of the present disclosure.

FIG. 1 is a diagram of an exemplary embodiment of an assembly in which aboard level shield (BLS) is disposed about a battery area of anelectronic device such that heat may be transferred to the device'sexternal casing by a thermally-conductive heat path generally around thebattery area (and battery therein) through or along the BLS;

FIG. 2 is an exploded perspective view showing the various components ofthe assembly and electronic device of FIG. 1;

FIG. 3 is a diagram of an exemplary embodiment of an assembly in which athermal interface material (TIM) is disposed about a battery area of anelectronic device such that heat may be transferred to the device'sexternal casing by a thermally-conductive heat path generally around thebattery area (and battery therein) through or along the TIM;

FIG. 4 is an exploded perspective view showing various components of theassembly and electronic device of FIG. 3;

FIG. 5 is a diagram of another exemplary embodiment of an assembly inwhich a board level shield (BLS) is disposed about a battery area of anelectronic device such that heat may be transferred to the device'sexternal casing by a thermally-conductive heat path generally around thebattery area (and battery therein) through or along the BLS;

FIG. 6 is a diagram of another exemplary embodiment of an assembly inwhich a thermally-conductive heat path is provided or defined generallyaround a battery area of an electronic device by portions of a thermalinterface material (TIM) and board level shield (BLS);

FIG. 7 is a diagram of an exemplary embodiment of an assembly in which athermal interface material (TIM) is disposed about a battery area of anelectronic device such that heat may be transferred to the device'sexternal casing by a thermally-conductive heat path generally around thebattery area (and battery therein) through or along the TIM;

FIG. 8 is a diagram of an exemplary embodiment of an assembly in whichan EMI shielding/thermal interface material (e.g., thermally andelectrically conductive elastomer, etc.) is disposed about a batteryarea of an electronic device such that heat may be transferred to thedevice's external casing by a thermally-conductive heat path generallyaround the battery area (and battery therein) through or along the EMIshielding/thermal interface material;

FIG. 9 illustrates computational fluid dynamics (CFD) results showingexternal temperatures (in degrees Celsius) of an external casing of anelectronic device, in which the computational model included athermally-conductive heat path through a BLS around the battery area(and battery therein) in accordance with exemplary embodiments;

FIG. 10 illustrates CFD results showing external temperatures (indegrees Celsius) of an external casing of an electronic device, in whichthe computational model included a thermally-conductive heat paththrough a TIM around the battery area (and battery therein) inaccordance with exemplary embodiments;

FIG. 11 illustrates CFD results showing external temperatures in degreesCelsius of an external casing of an electronic device, in which thecomputational model did not include a thermal solution orthermally-conductive heat around the battery area (and battery therein),for purposes of creating a baseline for comparison to FIGS. 9 and 10;

FIG. 12 is a diagram illustrating an assembly, which is represented bythe baseline model without a thermal solution used to obtain the CFDresults shown in FIG. 11;

FIG. 13 is an exploded perspective view of an exemplary embodiment of atwo-piece BLS that may be used, for example, in the exemplaryembodiments shown in FIG. 3, FIG. 6, and/or FIG. 7;

FIG. 14 is a diagram of another exemplary embodiment of an assembly inwhich a first TIM is installed or applied onto one or more heatgenerating components of a printed circuit board (PCB), a board levelshield (BLS) is installed over the PCB component to provide EMIshielding, and a second TIM thermally contacts the first TIM and theexterior casing of the device such that a thermally-conductive heat pathis provided or defined generally around a battery area of the devicefrom the heat-generating components to the exterior casing; and

FIG. 15 is a diagram of another exemplary embodiment of an assembly inwhich a TIM is installed or applied onto one or more heat generatingcomponents of a printed circuit board (PCB) such that athermally-conductive heat path is provided or defined generally around abattery area of the device from the heat-generating components to theexterior casing.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference tothe accompanying drawings.

Heat from heat generating components must typically be dissipated to anarea external to the enclosed circuit board, to avoid damage to heatproducing components, such as a power amplifier. For example, heat fromcellular phones and other portable communications terminals musttypically be transported or transferred externally from the cellularphone to the surrounding ambient environment to avoid damage to the PCBcomponents within the cellular phone.

A conventional cellular phone typically includes a board level shield(BLS) placed directly on the printed circuit board (PCB) over at leastsome of the heat producing and/or hot components on the PCB. Withcurrent cellular phones, the battery is typically placed above the PCBand BLS, which has heretofore prevented a direct thermally-conductiveheat path from the heat source or heat producing components on the PCBto the cellular phone's external case, casing, or housing. In contrastto the conventional wisdom, the inventors have recognized the uniqueopportunity of using an EMI shield (e.g., BLS, etc.) as a heat spreaderas well as a thermally-conductive heat path away from the hot componentson the PCB to the external case of the cellular phone.

Disclosed herein are various embodiments of assemblies and methods forcircumventing the problem (recognized by the inventors hereof) caused byhaving the battery located above the BLS and PCB. In various exemplaryembodiments disclosed herein, heat may be dissipated and removed heatfrom an electronic device by way of a thermally-conducting heat path tothe external casing via an EMI shield (or portions thereof) and/or athermal interface material (TIM) (or portions thereof) disposed aroundthe device's battery area and/or battery (or other power source).

In a first exemplary embodiment, at least a portion of an EMI shield(e.g., at least a portion of a BLS, etc.) may be configured (e.g.,oversized, shaped, located, etc.) to be disposed (e.g., wrapped about abattery, etc.) about a battery area (e.g., compartment, etc.) of anelectronic device (e.g., cellular phone, etc.) such that heat may betransferred to the device's external casing by a thermally-conductiveheat path generally around the battery area (and battery or other powersource therein) through or along the shield (or portions thereof). Theshield may be configured for direct interface or physical contact withthe device's external casing. Or, for example, a TIM may be disposedgenerally between the shield and the device's external casing.Additionally, or alternatively, a TIM may be disposed generally betweenthe shield and the heat source or heat-producing components on the PCB.Some embodiments may include a thermally-conductive heat path thatallows heat to be transferred from a heat source or heat-producingcomponents on a PCB to a first TIM, from the first TIM to an EMI shieldhaving one or more portions generally around the battery area, from theEMI shield to a second TIM, and finally from the second TIM to thedevice's external casing. In various embodiments, the casing may beformed from a material(s) such that the casing has a thickness of about0.625 millimeters and a thermal conductivity (k) of 0.14 Watts per meterper Kelvin. These numerical values are provided for illustrativepurposes only (as are all dimensions, numerical values, and specificmaterials disclosed herein). Other embodiments may include or be usedwith a casing having a different thickness and/or different thermalconductivity. In addition, some embodiments may include an electronicdevice casing that is provided with or includes (e.g., attached thereto,integrally formed with, injection molded with, etc.) EMI shieldingmaterial(s) disposed generally about the battery area of the casing,such that portions of a separate BLS are not necessarily positionedabout the battery area within the casing. In other embodiments, EMIshielding material(s) may be attached to or wrapped about a battery(e.g., by the battery manufacturer, etc.) before the battery is insertedor positioned within the battery area of the casing.

In a second exemplary embodiment, at least a portion of a TIM may beconfigured (e.g., oversized, shaped, located, etc.) to be disposed(e.g., wrapped, etc.) about a battery area (e.g., compartment, etc.) ofan electronic device (e.g., cellular phone, etc.) such that heat may betransferred to the device's external casing by a thermally-conductiveheat path generally around the battery area (and battery or other powersource therein) through or along the TIM (or portions thereof). The TIMmay be configured for direct interface or physical contact with thedevice's external casing. Or, for example, another TIM may be disposedgenerally between the first TIM and the device's external casing.Additionally, or alternatively, the TIM may also include a portiondisposed generally between the battery area and a EMI shield, whichshield may be disposed generally over the heat source or heat-producingcomponents on the PCB. In some embodiments, another TIM may bepositioned generally between the shield and the heat source orheat-producing components on the PCB. Accordingly, some embodiments mayinclude a thermally-conductive heat path that allows heat to betransferred from a heat source or heat-producing components on a PCB toa first TIM, from the first TIM to a shield, from the shield to a secondTIM having one or more portions generally around the battery area, andfinally from the second TIM to the device's external casing. In variousembodiments, the casing may be formed from a material(s) such that thecasing has a thickness of about 0.625 millimeters and a thermalconductivity (k) of 0.14 Watts per meter per Kelvin. These numericalvalues are provided for illustrative purposes only (as are alldimensions, numerical values, and specific materials disclosed herein).Other embodiments may include or be used with a casing having adifferent thickness and/or different thermal conductivity. In addition,some embodiments may include an electronic device casing that isprovided with or includes (e.g., attached thereto, integrally formedwith, injection molded with, etc.) one or more TIMs disposed generallyabout the battery area of the casing. In other embodiments, one or moreTIMs (e.g., thermally-conductive compliant pads with adhesive backing,etc.) may be attached to or wrapped about a battery (e.g., by thebattery manufacturer, etc.) before the battery is inserted or positionedwithin the battery area of the casing. By way of example, aluminum foilor copper foil (e.g., foil that is only a few mils thick, etc.) may belaminated with a TIM so as to provide a relatively rigid compartmentinto which a battery or other power source may be received. As anotherexample, a battery manufacturing company may wrap a TIM around abattery, so that the “TIM wrapped battery” may then be inserted into thedevice's battery area or compartment. An additional example includesinjection moldable thermally-conductive plastic to form the batterycompartment of the device and thermally-conductive heat path around thebattery compartment.

A third exemplary embodiment may include one or more materials that areoperable as both an EMI shield and thermal interface. In suchembodiments, an EMI shielding/thermal interface combination (e.g.,thermally and electrically conductive elastomer, etc.) may be disposedgenerally between a device's casing and heat source on a PCB, so as toprovide EMI shielding for one or more components on the PCB and toprovide, define, or establish a thermally-conductive heat path from theheat source, generally around the device's battery area (and/or batteryor other power source) to the device's casing. This thermal designsolution preferably reduces the overall contact resistance between theheat source and the device's casing. In various embodiments, the casingmay be formed from a material(s) such that the casing has a thickness ofabout 0.625 millimeters and a thermal conductivity (k) of 0.14 Watts permeter per Kelvin. These numerical values are provided for illustrativepurposes only (as are all dimensions, numerical values, and specificmaterials disclosed herein). Other embodiments may include or be usedwith a casing having a different thickness and/or different thermalconductivity. In addition, some embodiments may include an electronicdevice casing that is provided with or includes (e.g., attached thereto,integrally formed with, injection molded with, etc.) the EMIshielding/thermal interface combination disposed generally about thebattery area of the casing. In other embodiments, the EMIshielding/thermal interface combination may be attached to or wrappedabout a battery (e.g., by the battery manufacturer, etc.) before thebattery is inserted or positioned within the battery area of the casing.

Some embodiments disclosed herein may provide relatively low costthermal solutions. Some embodiments disclosed herein may be relativelyeasy to install in the production process.

Referring now to FIG. 1, there is shown an exemplary embodiment of anassembly 100 embodying one or more aspects of the present disclosure. Inthis particular embodiment, the assembly 100 is installed generallybetween a heat source 104 (e.g., heat generating board-mountedelectronic components, etc.) on a printed circuit board (PCB) 102 and anexternal casing or housing 150 of an electronic device. As disclosedherein, the assembly 100 is operable for providing EMI shielding to oneor more electronic components on the PCB 102 and also for providing athermally-conductive heat path generally around the battery area 130.The thermally-conductive heat path allows heat from the heat source 104to be transferred to the external casing 150 via a first thermalinterface material (TIM) 108, an EMI shield 110, and a second interfacematerial 140.

As shown in FIG. 1, the shield 110 is disposed generally about thebattery area 130 such that heat may be transferred through the shield110 generally around the battery area 130. In some embodiments, theshield 110 may be configured (e.g., oversized, etc.) such that a portionof the shield 110 may be wrapped (e.g., manually wrapped around thebattery by the battery manufacturer, etc.) around a battery to be placedwithin the battery area 130. In other embodiments, the shield 110 may besufficiently sized large enough or oversized so as to be positionedgenerally over the battery area 130, a battery (e.g., 132 shown in FIG.2, etc.) therein, and one or more electronic components on the PCB 102.Alternative embodiments may include the shield having an upperthermally-conductive structure with sufficient rigidity so as tointegrally define a portion or area into which the battery may then beat least partially positioned, for example, after the shield has beenattached to the PCB.

The shield 110 is preferably configured so as to be operable as a heatspreader as well as being operable for providing EMI shielding. Theparticular configuration (e.g., size, shape, location, formation method,etc.) of the shield 110 will depend, at least in part, on the particularconfiguration of the battery area 130 (and battery to be receivedtherein) and the PCB 102 and components 104 thereon. Therefore, a widerange of EMI shields may be used for the shield 110, such as a singlepiece board level shield (BLS), a two piece BLS, one or more discreteEMI shielding walls, etc.

In addition, a wide range of materials may also be used for the shield110, which are preferably good electrical conductors and good thermalconductors. In various embodiments, the shield 110 may be made fromcopper-beryllium alloys, copper-nickel alloys, cold rolled steel,stainless steel, tin-plated cold rolled steel, tin-plated copper alloys,carbon steel, brass, copper, aluminum, phosphor bronze, steel,combinations thereof, among other suitable electrically conductivematerials. In one exemplary embodiment, the shield 110 may be formedfrom a sheet of copper-beryllium alloy having a thickness of about 0.13millimeter. The materials and dimensions provided herein are forpurposes of illustration only, as the components thereof can beconfigured from different materials and/or with different dimensionsdepending, for example, on the particular application, such as thecomponent to be shielded, space considerations within the overallelectronic device, and heat dissipation needs.

As shown in FIG. 1, the shield 110 includes a generally horizontalportion 112 defining an underside or lower surface 114 and a topside orupper surface 116. In use, the shield portion 112 may be disposedgenerally over (and thus cover) one or more heat generating components104 on the PCB 102. The shield 110 also includes an upperthermally-conductive structure that is configured to be positionedgenerally around or integrally define corresponding portions of thebattery area 130. This upper thermally-conductive structure may be anintegral part of the shield 110, or it may be provided otherwise, suchas by separate attachment (e.g., welding, etc.) to the shield 110, etc.

In the illustrated embodiment in FIGS. 1 and 2, the shield's upperthermally-conductive structure comprises or is integrally defined by theshield's portion 112, side portions 122, 124, and laterally extendingportions 126, 128. In this particular illustration of FIG. 1, a spaceseparates the portions 126, 128, though other embodiments may include asingle continuous top portion without the separation. Also in thisillustrated embodiment, the shield 110 is shown as a single piece shieldhaving a monolithic construction. Advantageously, a single piece shieldmay allow for better heat transfer as compared to a multi-piece shieldin which the pieces are connected via junctions or interfaces, whichmight otherwise transfer heat slower or less efficiently than a single,monolithic shield without any such junctions or interfaces. Thisnothwithstanding, alternative embodiments may include a shield formedfrom a plurality of pieces.

With continued reference to FIG. 1, the shield's side portions 122, 124extend upwardly above the shield's portion 112. The shield's laterallyextending portions 126 and 128 extend laterally inward from the sideportions 122, 124, respectively. The shield's side portions 122, 124,laterally extending portions 126, 128, and portion 112 together form anarea 130 configured to receive the battery or other power source. Theshield's side portions 122, 124, laterally extending portions 126, 128,and portion 112 may be configured to be positioned generally around thebattery area 130 (and battery therein) to thereby form athermally-conductive heat path around the battery area 130 (and batterytherein). Alternatively, the shield portions 122, 124, 126, 128 may bewrapped up and around the battery (e.g., by the battery manufacturer,etc.) before or after the battery is placed in the area 130.

The shield's thermally-conductive structure 112, 122, 124, 126, 128allows heat to be transferred from the shield's portion 112 through theside portions 122, 124 and laterally extending portions 126, 128 abovethe area 130. In addition to the side portions 122, 124 that extendupwardly relative to the horizontal portion 112, the shield 110 mayfurther include side portions that extend downwardly from the generallyhorizontal portion 112 below the underside 114, to thereby form anenclosure below the underside 114 in which the one or more heatgenerating components 104 may be housed.

With continued reference to FIGS. 1 and 2, the TIM 108 may be disposedgenerally between the underside 114 of the shield 110 and the heatproducing components 104 on the PCB 102. The TIM 108 may comprise athermally-conductive compliant material that is disposed or attached(e.g., mechanically or adhesively attached or bonded, etc.) to theunderside 114 of the shield 110. In use, the TIM 108 provides forthermal conduction of heat from the one or more components 104 to theshield 110, thus facilitating the transfer of heat generated by the oneor more components 104 to the shield 110.

As shown in FIG. 2, the shield 110 may be secured or attached (asindicated by the dashed line in FIG. 2) to the circuit board 102generally over the one or more heat generating components 104. In someexemplary embodiments, the TIM 108 (e.g., thermally thermally-conductivecompliant material, etc.) may be sandwiched, deformed, deflected, orcompressed between the shield 110 and the one or more heat generatingcomponents 104, when the shield 110 is secured in place over the one ormore heat generating components 104. For example, a force may begenerated that deflects or deforms the TIM 108 generally between theshield's underside 114 and the top of one or more heat generatingcomponents 104. The force and resulting deflection/deformation of theTIM 108 against the upper portion of the one or more electroniccomponents 104 may reduce thermal impedance therebetween.

The contact between the one or more heat generating components 104 andthe TIM 108 creates a portion of a thermally-conducting heat paththrough which heat generated by a component 104 may be conducted fromthe component 104 through the TIM 108 to the shield 110, then throughthe shield's thermally-conductive structure 112, 122, 124, 126, 128generally around the battery area 130 to the TIM 140, and finally to theexterior casing 150 for dissipation to the surrounding ambientenvironment or area external to the casing 150. The deflection ordeformation of the TIM 108 between the shield 110 and component 104 canthus allow for improved heat transfer from the component 104 to theshield 110, as compared to heat transfer solely by air.

In the exemplary embodiment shown in FIGS. 1 and 2, a second thermalinterface material (TIM) 140 is positioned generally between the shield110 and exterior casing 150. The second TIM 140 contacts the laterallyextending portions 126, 128 of the shield 110. The TIM 140 is operablefor thermally conducting heat from the shield 110 to the casing 150.

The TIMs 108, 140, and the shield 110 (portions 112, 122, 124, 126, 128)provide, establish, or define a thermal-conducting heat path from theone or more heat generating components 104 to the casing 150.Accordingly, the shield 110 and TIMs 108, 140 are operable and useful asa heat-transmitter and/or heat-spreader to conduct heat from heatgenerating components 104 around the battery area 130 to the casing 150,to thereby help improve thermal performance by conducting and/ordissipating heat to an area external to the casing 150.

FIG. 3 illustrates another exemplary embodiment of an assembly 300embodying one or more aspects of the present disclosure. In thisparticular embodiment, the assembly 300 is installed generally between aheat source 304 (e.g., heat generating board-mounted electroniccomponents, etc.) on a printed circuit board (PCB) 302 and an externalcasing or housing 350 of an electronic device. As disclosed herein, theassembly 300 is operable for providing EMI shielding to one or morecomponents on the PCB 302 and also for providing a thermally-conductiveheat path generally around the battery area 330. Thethermally-conductive heat path allows heat from the heat source 304 tobe transferred to the external casing 350 via a first thermal interfacematerial (TIM) 308, an EMI shield 310, and a second interface materialor thermally-conductive structure 320, which is disposed around ordefines the battery area 330.

As shown in FIG. 3, the TIM 320 is disposed generally about or definesthe battery area 330 such that heat may be transferred through the TIM320 generally around the battery area 330. In some embodiments, the TIM320 may be sufficiently sized large enough or oversized so as to bewrapped (e.g., manually wrapped around a battery by a batterymanufacturer, etc.) up and around the battery (e.g., 332 shown in FIG.4, etc.) before or after placement within the battery area 330. In suchembodiments, the TIM 320 may be attached (e.g., adhesively attached,bonded, etc.) to the shield 310 prior to or after being wrapped aroundthe battery. In other embodiments, the TIM 320 may be a sufficientlyrigid material that integrally defines a portion or area into which thebattery may then be at least partially positioned. In other embodiments,the TIM 320 may comprise one or more thermally-conductive pads withadhesive backing that are attached to a battery before the battery isinserted or positioned within the battery area of the casing. By way ofexample, aluminum foil or copper foil (e.g., foil that is only a fewmils thick, etc.) may be laminated with the TIM so as to provide arelatively rigid compartment into which a battery or other power sourcemay be received. As another example, a battery manufacturing company maywrap a TIM around a battery, so that the “TIM wrapped battery” may thenbe inserted into the device's battery area or compartment. An additionalexample includes injection moldable thermally-conductive plastic to formthe battery compartment of the device and thermally-conductive heat patharound the battery compartment.

The particular configuration (e.g., size, shape, location, formationmethod, etc.) of the TIM 320 will depend, at least in part, on theparticular configuration of the battery area 330 and battery to bereceived therein. Therefore, a wide range of TIM configurations may beused for the TIM 320, such as a single TIM piece that is wrapped aboutthe battery, a plurality of TIM pieces, etc.

As shown in FIG. 3, the TIM 320 generally includes portions 321, 322,324, and 326 that are respectively disposed around or define the batteryarea 330, thus forming a thermally-conducting heat path around thebattery area 330 to the casing 350. In the illustrated embodiment, theTIM 320 is shown as a single piece shield having a monolithicconstruction that includes all four portions 321, 322, 324, and 326.Advantageously, a single piece TIM may allow for better heat transfer ascompared to a multi-piece TIM in which the TIM pieces are connected viajunctions or interfaces, which might otherwise transfer heat slower orless efficiently than a single, monolithic TIM without any suchjunctions or interfaces. This nothwithstanding, alternative embodimentsmay include a multi-piece TIM having two or more pieces of thermalinterface material. The TIM portion 321 may be attached (e.g.,adhesively attached, bonded, etc.) to the topside 316 of the shield 310prior to or after installation to the electronic device.

In this illustrated embodiment, the upper and lower portions 321, 326are generally horizontal and parallel to each other, whereas the sideportions 322, 324 are generally vertical and parallel to each other.These portions 321, 322, 324, and 326 cooperatively define a generallyrectangular area in which at least a portion of the battery may bereceived. Alternative embodiments may include a different configurationfor the TIM 320. And, the particular horizontal and verticalorientations of the TIM portions will depend on the orientation of theelectronic device in which the TIM is installed.

The shield 310 may be configured to be disposed generally over (and thuscover) one or more heat generating components 304 on the PCB 302. Theparticular configuration (e.g., size, shape, location, formation method,etc.) of the shield 310 will depend, at least in part, on the particularconfiguration of the PCB 302 and components 304. Thus, a wide range ofEMI shields may be used for the shield 310, such as a single piece boardlevel shield (BLS), a two piece BLS, one or more discrete EMI shieldingwalls, a two-piece shield 1300 shown in FIG. 13, etc.

In addition, a wide range of materials may also be used for the shield310, which are preferably good electrical conductors and good thermalconductors. In various embodiments, the shield 310 may be made from,copper-beryllium alloys, copper-nickel alloys, cold rolled steel,stainless steel, tin-plated cold rolled steel, tin-plated copper alloys,carbon steel, brass, copper, aluminum, phosphor bronze, steel,combinations thereof, among other suitable electrically conductivematerials. In one exemplary embodiment, the shield 310 may be formedfrom a sheet of copper-beryllium alloy having a thickness of about 0.13millimeter. The materials and dimensions provided herein are forpurposes of illustration only, as the components thereof can beconfigured from different materials and/or with different dimensionsdepending, for example, on the particular application, such as thecomponent to be shielded, space considerations within the overallelectronic device, and heat dissipation needs.

In the illustrated embodiment of FIGS. 3 and 4, the shield 310 includesan upper surface or topside 316 and a lower surface or underside 314.The TIM 308 may be disposed generally between the shield's underside 314and the heat producing components 304 on the PCB 302. The TIM 308 maycomprise a thermally-conductive compliant material that is disposed orattached (e.g., adhesively attached, bonded, etc.) to the shield'sunderside 314. In use, the TIM 308 provides for thermal conduction ofheat from the one or more components 304 to the shield 310, thusfacilitating the transfer of heat generated by one or more components304 to the cover 310.

As shown in FIG. 4, the shield 310 may be secured or attached (asindicated by the dashed line in FIG. 4) to the circuit board 302generally over the one or more heat generating components 304. In someexemplary embodiments, the TIM 308 (e.g., thermally thermally-conductivecompliant material, etc.) may be sandwiched, deflected, deformed, orcompressed between the shield 310 and the one or more heat generatingcomponents 304, when the shield 310 is secured in place over the one ormore heat generating components 304. For example, a force may begenerated that deflects or deforms the TIM 308 generally between theshield's underside 314 and the top of one or more heat generatingcomponents 304. The force and resulting deflection or deformation of theTIM 308 against the upper portion of the one or more electroniccomponents 304 may reduce thermal impedance therebetween.

The contact between the one or more heat generating components 304 andthe TIM 308 creates a portion of a thermally-conducting heat paththrough which heat generated by an electronic component 304 may beconducted from the component 304 through the TIM 308 to the shield 310,then through the portions 321, 322, 324, 326 of the TIM 320 generallyaround the battery area 330, and finally to the exterior casing 350 fordissipation to the surrounding ambient environment or area external tothe casing 350. The deflection or deformation of the TIM 308 between theshield 310 and electronic component 304 can thus allow for improved heattransfer from the electronic component 304 to the shield 310, ascompared to heat transfer solely by air.

The TIM 308, shield 310, and portions 321, 322, 324, and 326 of the TIM320 provide, establish, or define a thermal-conducting heat path fromthe one or more heat generating components 304 to the casing 350.Accordingly, the shield 310 and TIMs 308, 320 are operable and useful asa heat-transmitter and/or heat-spreader to conduct heat from heatgenerating components 304 around the battery area 330 to the casing 350,to thereby help improve thermal performance by conducting and/ordissipating heat to an area external to the casing 350.

FIG. 5 illustrates another exemplary embodiment of an assembly 400embodying one or more aspects of the present disclosure. In thisparticular embodiment, the assembly 400 is installed generally between aheat source 404 (e.g., heat generating board-mounted electroniccomponents, etc.) on a printed circuit board (PCB) 402 and an externalcasing or housing 450 of an electronic device. The assembly 400 isoperable for providing EMI shielding to one or more electroniccomponents on the PCB 402 and also for providing a thermally-conductiveheat path generally around the battery area 430. Thethermally-conductive heat path allows heat from the heat source 404 tobe transferred to the external casing 450 via a first thermal interfacematerial (TIM) 408 and the EMI shield 410. In comparison to the assembly100 shown in FIG. 1, this assembly 400 does not include a secondinterface material between the casing 450 and shield 410, such that heatmay be transferred from the shield 410 directly to the exterior casing450. In this exemplary embodiment, the shield 410 may be polymer-basedor other suitable material.

In other embodiments, an assembly may also include a shield disposedgenerally around the battery area without any thermal interfacematerials. In such alternative embodiments, heat would thus betransferred from the heat source directly to the shield, then through oralong the shield generally around the battery area, and then from theshield directly to the casing.

In still further embodiments, an assembly may include a shield disposedgenerally around the battery area with a thermal interface material onlybetween the shield and the heat source. In these embodiments, theassembly would not include a thermal interface material between theshield and the casing. In such embodiments, heat would thus betransferrable from the heat source to the TIM, through or along the TIM,from the TIM to the shield, through or along the shield around thebattery area, and then from the shield directly to the casing.

FIG. 6 illustrates another exemplary embodiment of an assembly 500embodying one or more aspects of the present disclosure. In thisparticular embodiment, the assembly 500 is installed generally between aheat source 504 (e.g., heat generating board-mounted electroniccomponents, etc.) on a printed circuit board (PCB) 502 and an externalcasing or housing 550 of an electronic device. The assembly 500 isoperable for providing EMI shielding to one or more electroniccomponents 504 on the PCB 502 and also for providing athermally-conductive heat path generally around the battery area 530.The thermally-conductive heat path allows heat from the heat source 504to be transferred to the external casing 550 via a first thermalinterface material (TIM) 508, the EMI shield 510, and the second TIM520. In comparison to the assembly 300 shown in FIG. 3, this assembly500 does not include the bottom or lowest TIM portion 321, such that theheat path around the battery area 530 includes or is defined by portionsof the TIM 520 and shield 510.

FIG. 7 illustrates another exemplary embodiment of an assembly 600embodying one or more aspects of the present disclosure. In thisparticular embodiment, the assembly 600 is installed generally between aheat source 604 (e.g., heat generating board-mounted electroniccomponents, etc.) on a printed circuit board (PCB) 602 and an externalcasing or housing 650 of an electronic device. The assembly 600 isoperable for providing EMI shielding to one or more electroniccomponents on the PCB 602 and also for providing a thermally-conductiveheat path generally around the battery area 630. Thethermally-conductive heat path allows heat from the heat source 604 tobe transferred to the external casing 650 via the EMI shield 610 and thethermal interface material (TIM) 620. This particular embodiment doesnot include thermal interface material between the heat source 604 andthe shield 610, such that heat may be transferred from the heat source604 directly to the shield 610.

With continued reference to FIG. 7, the TIM 620 is disposed generallyaround or defines the battery area 630, thus forming athermally-conducting heat path around the battery area 630 to the casing650. While FIG. 7 illustrates the TIM 620 as a single piece of thermalinterface material, other embodiments may include two or more pieces ofthermal interface material disposed about or defining the battery area.

FIG. 8 illustrates another exemplary embodiment 800 embodying one ormore aspects of the present disclosure. By way of example, theembodiment 800 may include a material(s) operable as both an EMI shield810 and as a thermal interface 820. As shown in FIG. 8 the EMIshielding/thermal interface combination 810, 820 (e.g., electrically andthermally conductive elastomer, etc.) is installed generally between aheat source 804 (e.g., heat generating board-mounted electroniccomponents, etc.) on a printed circuit board (PCB) 802 and an externalcasing or housing 850 of an electronic device. The combined EMIshielding/thermal interface 810, 820 is operable for providing EMIshielding to one or more components on the PCB 802 and also forproviding a thermally-conductive heat path generally around the batteryarea 830. The thermally-conductive heat path allows heat from the heatsource 804 to be transferred to the external casing 850 via the EMIshielding/thermal interface 810, 820. This particular embodiment doesnot include an EMI shield that is separate from a thermal interfacematerial. By having a combined EMI shield/thermal interface, thisembodiment may help reduce the overall contact resistance between theheat source and the device's casing.

As another example, however, the embodiment 800 may include only athermal interface material 820 without any EMI shielding 810. In suchexample, the thermal interface material 820 would operable for providinga thermally-conductive heat path generally around the battery area 830.The thermally-conductive heat path allows heat from the heat source 804to be transferred to the external casing 850 via the thermal interface820.

In a further example, the embodiment 800 may include only the EMI shield810 without any interface material 820. In this example then, the EMIshield 810 would be operable for providing EMI shielding to one or morecomponents on the PCB 802 and also for providing a thermally-conductiveheat path generally around the battery area 830. Thethermally-conductive heat path allows heat from the heat source 804 tobe transferred to the external casing 850 via the EMI shield 810.

FIG. 14 illustrates another exemplary embodiment 1400 embodying one ormore aspects of the present disclosure. As shown in FIG. 14, theassembly 1400 is installed generally between a heat source 1404 (e.g.,heat generating board-mounted electronic components, etc.) on a printedcircuit board (PCB) 1402 and an external casing or housing 1450 of anelectronic device. The assembly 1400 is operable for providing EMIshielding to one or more electronic components 1404 on the PCB 1402 andalso for providing a thermally-conductive heat path generally around thebattery area 1430. More specifically, the thermally-conductive heat pathallows heat from the heat source 1404 to be transferred to the externalcasing 1450 via a first thermal interface material (TIM) 1408 in contactwith the PCB components 1404 and a second thermal interface material1420 in contact with the first TIM 1408 and casing 1450.

Also shown in FIG. 14 is an EMI shield 1410 (e.g., board level shield(BLS), etc.) is installed over the PCB components 1404 and the first TIM1408. In this embodiment, the first TIM 1408 may first be installed onthe PCB components 1404. Then, the EMI shield 1410 may be installed(e.g., snapped onto a frame, etc.) such that an air gap 1454 separatesthe EMI shield 1410 from the first TIM 1408. In other embodiments, theEMI shield 1410 may contact the first TIM 1408.

Also FIG. 14 illustrates the EMI shield 1410 in contact with the secondTIM 1420. But this contact between the EMI shield 1410 and the secondTIM 1420 may be minimal or relatively insignificant such that the EMIshield 1410 is not a part of the primary heat conduction path from thePCB components 1404 to the casing 1450. In other embodiments, the EMIshield 1410 may be configured (e.g., sized, shaped, etc.) such that itdoes not contact the second TIM 1420.

While the EMI shield 1410 may conduct heat in some embodiments, theprimary heat conduction heat path in this embodiment 1400 illustrated inFIG. 14 is defined or provided by the first and second TIMs 1408, 1420.More specifically, the TIM 1420 includes lateral or side portions 1422,1424 extending downward into contact with the first TIM 1408. These sideportions 1422, 1424 extend upward to the top or upper portion 1426 ofthe second TIM 1420, which, in turn, is in contact with the casing 1450.Accordingly, heat is transferrable from the heat source 1404 to thefirst TIM 1408, upwards through the side portions 1422, 1424 of thesecond TIM 1420, to the upper portion 1426 of the second TIM 1420, andthen to the casing 1450.

In the particular illustration of FIG. 14, the second TIM 1420 is shownas a single piece having a monolithic construction. Advantageously, thissingle piece TIM may allow for better heat transfer as compared tomultiple TIMs which are connected or contact via junctions orinterfaces, which might otherwise transfer heat slower or lessefficiently than a single, monolithic TIM without any such junctions orinterfaces. This nothwithstanding, alternative embodiments may include asecond TIM 1420 formed from a plurality of pieces.

Advantageously, the overall contact resistance between the heat source1404 and casing 1450 may be reduced by having the primary heatconduction path formed or provided solely by first and second TIMs 1408,1420 that are conformable and without non-conformable, rigid metal EMIshield forming part of the primary heat conduction path.

In some embodiments, the TIMs 1408 and 1420 are thermally andelectrically conductive elastomer (e.g., elastomer and thermallyconductive filler, etc.), such that the TIMs 1408, 1420 may provide someEMI shielding though the EMI shield 1410 would be the primary EMIshielding component. Alternative embodiments may include other suitablematerials besides thermally and electrically conductive elastomer. Inother example embodiments, the first and second TIMs 1408, 1420 may bethermally conductive electrical insulators in which case the TIMs 1408,1420 would not provide any EMI shielding.

Alternative embodiments may include one or more TIMs without any EMIshield. In such alternative embodiments, the one or more TIMs may beinstalled or applied relative to one or more heat generating componentsof a printed circuit board (PCB) such that a thermally-conductive heatpath is provided or defined generally around a battery area of thedevice from the heat-generating components to the exterior casing.

For example, FIG. 15 illustrates an embodiment 1500 that includes onlythe thermal interface material 1508 without any EMI shield. In thisexample then, the TIM 1508 is operable for providing athermally-conductive heat path generally around the battery area 1530.The thermally-conductive heat path allows heat from the heat source 1504to be transferred to the external casing 1550 via the TIM 1508.

With continued reference to FIG. 15, the TIM 1508 includes an bottom orlower portion 1509 in contact with the heat source 1504 (e.g., PCBcomponents, etc.). The TIM 1508 also includes lateral or side portions1511, 1513 extending upwards from the lower portion 1509 to the top orupper portion 1515 of the TIM 1508. The upper portion 1515 is in contactwith the casing 1550. Accordingly, heat is transferrable from the heatsource 1504 to the TIM lower portion 1509, upwards through the TIM sideportions 1511, 1513, to the TIM upper portion 1515, and then to thecasing 1550.

In the particular illustration of FIG. 15, the TIM 1508 is shown as asingle piece having a monolithic construction. Advantageously, a singlepiece TIM may allow for better heat transfer as compared to multipleTIMs which are connected or contact via junctions or interfaces, whichmight otherwise transfer heat slower or less efficiently than a single,monolithic TIM without any such junctions or interfaces.

Alternative embodiments may include a plurality of TIMs and/ormultilayered thermal interface materials or structures that form a heatpath generally around a battery area. The multilayered thermal interfacematerial or structure may comprise interior heat spreader (e.g., coreformed from metal, metal alloy, graphite, sheet of stamped aluminum orcopper, etc.) sandwiched between layers of thermal interface material(e.g., phase change material, gap filler, thermal grease, combinationsthereof, etc.).

For example, and with further reference to FIG. 15, the TIM 1508 may beconfigured as multilayered heat spreading thermal interface structure asdisclosed in U.S. Pat. No. 7,078,109, the entire disclosure of which isincorporated herein by reference in their entirety. In such embodiment,the TIM 1508 may be configured as a multilayered thermal interfacestructure that includes a plurality of layers including a core body ofhigh conductivity metal or metal alloy (e.g., copper or aluminum foilsheet, etc.) having opposite sides along which is disposed thermalinterface materials (e.g., phase change material, thermal grease, gapfiller, combinations thereof, etc.), In an exemplary embodiment, phasechange material (e.g., organic, non-metallic, or polymeric phase changematerial, etc.) may be disposed on one side of the core body, forexample, for mounting against the heat source 1504. A soft thermalinterface layer (e.g., gap filler material or pad, etc.) may be disposedon the other side of the core body for contacting the exterior casing1550. The soft thermal interface layer may be configured with acomposition which is compressible or deflectable such that when squeezedit will allow for thickness tolerance differences. The soft thermalinterface layer may have a thickness substantially greater than thethickness of the layer of phase change material to accommodate variablespacing.

In this example, the TIM 1508 thus includes the bottom or lower portion1509 formed from a phase change material in contact with the heat source1504 (e.g., PCB components, etc.). The TIM 1508 also includes thelateral or side portions 1511, 1513 formed from metal or metal alloythat extend upwards from the lower portion 1509 to the top or upperportion 1515 of the TIM 1508. The upper portion 1515 is formed from thesoft thermal interface material and is in contact with the casing 1550.Accordingly, heat is transferrable from the heat source 1504 to thephase change material bottom portion 1509, upwards through the metal ormetal alloy side portions 1511, 1513, to the soft TIM upper portion1515, and then to the casing 1550.

A wide variety of materials may be used for any one or more TIMs inembodiments disclosed herein. The TIMs are preferably formed frommaterials, which preferably are better thermal conductors and havehigher thermal conductivities than air alone. Exemplary embodimentsinclude one or more of T-Flex™ 300 series thermal gap filler materials,T-Flex™ 600 series thermal gap filler materials, Tpcm™ 580 series phasechange materials, Tpli™ 200 series gap fillers, and/or Tgrease™ 880series thermal greases from Laird Technologies, Inc. of Saint Louis,Mo., and, accordingly, have been identified by reference to trademarksof Laird Technologies, Inc. Details on these different materials isavailable at www.lairdtech.com.

As shown in the tables below, T-Flex™ 300 series thermal gap fillermaterials generally include, e.g., ceramic, filled silicone elastomerwhich will deflect to over 50% at pressures of 50 pounds per square inchand other properties shown below. T-Flex™ 600 series thermal gap fillermaterials generally include boron nitride filled silicone elastomer,which recover to over 90% of their original thickness after compressionunder low pressure (e.g., 10 to 100 pounds per square inch, etc.), havea hardness of 25 Shore 00 or 40 Shore 00 per ASTM D2240, and otherproperties as shown in table below. Tpli™ 200 series gap fillersgenerally include reinforced boron nitride filled silicone elastomer,have a hardness of 75 Shore 00 or 70 Shore 00 per ASTM D2240, and otherproperties as shown in table below. Tpcm™ 580 series phase changematerials are generally non-reinforced films having a phase changesoftening temperature of about 122 degrees Fahrenheit (50 degreesCelsius). Tgrease™ 880 series thermal grease is generally asilicone-based thermal grease having a viscosity of less than 1,500,000centipoises. Other embodiments may include a TIM with a hardness of less25 Shore 00, greater than 75 Shore 00, or somewhere therebetween.

By way of further example, other embodiments include a TIM molded fromthermally and electrically conductive elastomer. Additional exemplaryembodiments include thermally conductive compliant materials orthermally conductive interface materials formed from ceramic particles,metal particles, ferrite EMI/RFI absorbing particles, metal orfiberglass meshes in a base of rubber, gel, grease or wax, etc.

The tables below list various exemplary materials that may be used for aTIM in any one or more embodiments described and/or shown herein. Theseexample materials are commercially available from Laird Technologies,Inc. of Saint Louis, Mo., and, accordingly, have been identified byreference to trademarks of Laird Technologies, Inc. These tables areprovided for purposes of illustration only and not for purposes oflimitation.

Pressure of Thermal Thermal Thermal Impedance Construction ConductivityImpedance Measurement Name Composition Type [W/mK] [° C.-cm²/W] [kPa]T-flex ™ 620 Reinforced Gap 3.0 2.97 69 boron nitride Filler filledsilicone elastomer T-flex ™ 640 Boron nitride Gap 3.0 4.0 69 filledsilicone Filler elastomer T-flex ™ 660 Boron nitride Gap 3.0 8.80 69filled silicone Filler elastomer T-flex ™ 680 Boron nitride Gap 3.0 7.0469 filled silicone Filler elastomer T-flex ™ Boron nitride Gap 3.0 7.9469 6100 filled silicone Filler elastomer T-pli ™ 210 Boron nitride Gap 61.03 138 filled, silicone Filler elastomer, fiberglass reinforcedT-pcm ™ 583 Non-reinforced Phase 3.8 0.12 69 film Change T-flex ™ 320Ceramic filled Gap 1.2 8.42 69 silicone Filler elastomer T-grease ™Silicone-based Thermal 3.1 0.138 348 880 based grease Grease

The tables herein list various thermal interface materials that havethermal conductivities of 1.2, 3, 3.1, 3.8, and 6 W/mK. These thermalconductivities are only examples as other embodiments may include athermal interface material with a thermal conductivity higher than 6W/mK, less than 1.2 W/mK, or other value between 1.2 and 6 W/mk. Forexample, some embodiments may include a thermal interface material thathas a thermal conductivity higher than air's thermal conductivity of0.024 W/mK, such as a thermal conductivity greater than 0.082 W/mK or athermal conductivity of about 0.5 W/mK or greater.

T-flex ™ 620 T-flex ™ 640 T-flex ™ 660 T-flex ™ 680 T-flex ™ 6100 TESTMETHOD Construction & Reinforced Boron nitride Boron nitride Boronnitride Boron nitride Composition boron nitride filled silicone filledsilicone filled silicone elastomer filled silicone elastomer elastomerelastomer elastomer Color Blue-Violet Blue-Violet Blue-VioletBlue-Violet Blue-Violet Visual Thickness 0.020″ (0.51 mm) 0.040″ (1.02mm) 0.060″ (1.52 mm) 0.080″ (2.03 mm) 0.100″ (2.54 mm) Thicknesstolerance ±0.003″ ±0.004″ ±0.006″ ±0.008″ ±0.010″ (±0.08 mm) (±0.10 mm)(±0.15 mm) (±0.20 mm) (±0.25 mm) Density 1.38 g/cc 1.34 g/cc 1.34 g/cc1.34 g/cc 1.34 g/cc Helium Pycnometer Hardness 40 Shore 00 25 Shore 0025 Shore 00 25 Shore 00 25 Shore 00 ASTM D2240 Tensile Strength N/A 15psi 15 psi 15 psi 15 psi ASTM D412  % Elongation N/A 75 75 75 75 ASTMD412  Outgassing TML (Post Cured) 0.13% 0.13% 0.13% 0.13% 0.13% ASTME595  Outgassing CVCM (Post Cured) 0.05% 0.05% 0.05% 0.05% 0.05% ASTME595  UL Flammability Rating UL 94 VO UL 94 VO UL 94 VO UL 94 VO UL 94VO E180840 Temperature Range −45° C. to 200° C. −45° C. to 200° C. −45°C. to 200° C. −45° C. to 200° C. −45° C. to 200° C. ASTM D5470(modified) Thermal Conductivity 3 W/mK 3 W/mK 3 W/mK 3 W/mK 3 W/mKThermal Impedance @ 10 psi 0.46° C.-in²/W 0.62° C.-in²/W 0.85° C.-in²/W1.09° C.-in²/W 1.23° C.-in²/W ASTM D5470 @ 69 KPa 2.97° C.-cm²/W 4.00°C.-cm²/W 5.50° C.-cm²/W 7.04° C.-cm²/W 7.94° C.-cm²/W (modified) ThermalExpansion 600 ppm/° C. 430 ppm/° C. 430 ppm/° C. 430 ppm/° C. 430 ppm/°C. IPC-TM-650 2.4.24 Breakdown Voltage 3,000 volts AC >5,000 VoltsAC >5,000 Volts AC >5,000 Volts AC >5,000 Volts AC ASTM D149  VolumeResistivity 2 × 10¹³ ohm-cm 2 × 10¹³ ohm-cm 2 × 10¹³ ohm-cm 2 × 10¹³ohm-cm 2 × 10¹³ ohm-cm ASTM D257  Dielectric Constant @ 1 MHz 3.31 3.313.51 3.31 3.31 ASTM D150 

PROPERTIES Color Grey Density 2.73 g/cc Viscosity <1,500,000 cpsBrookfield Viscometer TF spindle at 2 rpm (helipath) and 23° C.Temperature Range −40-150° C. (−40-302° F.) UL Flammability Rating 94V0. File E 180840 Thermal Conductivity 3.1 W/mK Thermal Resistance @ 10psi 0.014° C.-in²/W (0.090° C.-cm²/W) @ 20 Psi 0.010° C.-in²/W (0.065°C. -cm²/W) @ 50 psi 0.009° C.- in^(2/)W (0.058° C.-cm²/W) VolumeResistivity (ASTM D257) 9 × 10¹³ Ohm-cm

Specifications

PROPERTIES Tpcm ™ 583 Tpcm ™ 585 Tpcm ™ 588 Tpcm ™ 5810 Construction &composition Non-reinforced film Color Gray Thickness 0.003″ (0.076 mm)0.005″ (0.127 mm) 0.008″ (0.2 mm) 0.010″ (0.25 mm) Density 2.87 g/ccOperating temperature range −40° C. to 125° C. (−40° C. to 257° F.)Phase change softening temperature 50° C. ( 122° F.) Thermal resistance10 psi 0.019° C.-in²/W 0.020° C.-in²/W 0.020° C.-in²/W 0.020° C.-in²/W(0.12° C.-cm²/W) (0.13° C.-cm²/W) (0.13° C.-cm²/W) (0.13° C.-cm²/W) 20psi 0.016° C.-in²/W 0.016° C.-in²/W 0.016° C .-in²/W 0.016° C.-in²/W(0.10° C.-cm²/W) (0.10° C.-cm²/W) (0.10° C.-in²/W) (0.010° C.-cm²/W) 50psi 0.013° C.-in²/W 0.013° C.-in²/W 0.013° C.-in²/W 0.013° C.-in²/W(0.08° C.-cm²/W) (0.08° C.-cm^(2/)W) ((0.08° C.-cm²/W) (0.08° C.-cm²/W)Thermal conductivity 3.8 W/mK Volume resistivity 3.0 × 10¹² ohm-cm

TFLI ™ 210 TPLI ™ 220 TPLI ™ 240 TPLI ™ 260 TPLI ™ 2100 TEST METHODConstruction & Reinforced Boron Boron Boron Boron Composition boronnitride nitride nitride nitride nitride filled filled filled filledfilled silicone silicone silicone silicone silicone elastomer elastomerelastomer elastomer elastomer Color Rose Blue Yellow Grey Grey VisualThickness 0.010″ 0.020″ 0.040″ 0.060″ 0.100″ (0.25 mm) (0.51 mm) (1.02mm) (1.52 mm) (2.54 mm) Thickness ±0.001″ ±0.002″ ±0.003″ ±0.004″±0.007″ Tolerance (±0.025 mm) (±0.05 mm) (±0.08 mm) (±0.10 mm) (±0.18mm) Density 1.44 g/cc 1.43 g/cc 1.43 g/cc 1.38 g/cc 1.36 g/cc HeliumPycnometer Hardness 75 Shore OO 70 Shore OO 70 Shore OO 70 Shore OO 70Shore OO ASTM D2240 Tensile Strength N/A 35 psi 35 psi 20 psi 15 psiASTM D412  % Elongation N/A 5 5 5 5 ASTM D412  Outgassing TML 0.08%0.07% 0.07% 0.10% 0.15% ASTM E595  (Post Cured) Outgassing CVCM 0.03%0.02% 0.02% 0.04% 0.07% ASTM E595  (Post Cured) UL Flammability 94 HB 94HB 94 HB 94 HB 94 HB E180840 Rating Temperature −45° C. to −45° C. to−45° C. to −45° C. to −45° C. to Range 200° C. 200° C. 200° C. 200° C.200° C. Thermal 6 W/mK 6 W/mK 6 W/mK 6 W/mK 6 W/mK ASTM D5470Conductivity (modified) Thermal impedance @ 20 psi 0.16° C.-in²/W 0.21°C.-in²/W 0.37° C.-in²/W 0.49° C.-in²/W 0.84° C.-in²/W ASTM D5470 @ 138KPa 1.03° C.-cm²/W 1.35° C.-cm²/W 2.45° C.-cm²/W 3.35° C.-cm²/W 5.81°C.-cm²/W (modified) Thermal Expansion 51 ppm/C. 123 ppm/C. 72 ppm/C. 72ppm/C. 96 ppm/C. IPC-TM-650 2.4.24 Breakdown voltage 1,0004,000 >5,000 >5,000 >5,000 ASTM D149  Volts AC Volts AC Volts AC VoltsAC Volts AC Volume Resisitivity 5 × 10¹³ ohm-cm 5 × 10¹³ ohm-cm 5 × 10¹³ohm-cm 5 × 10¹³ ohm-cm 5 × 10¹³ ohm-cm ASTM D257  Dielectric Constant3.21 3.21 3.26 3.26 3.4 ASTM D150  @ 1 MHz

TFLEX™ 300 Typical Properties

TFLEX ™ 300 TEST METHOD Construction Filled silicone NA elastomer ColorLight green Visual Thermal Conductivity 1.2 W/mK ASTM D5470 Hardness(Shore 00) 27 ASTM D2240 (at 3 second delay) Density 1.78 g/cc HeliumPyncometer Thickness Range 0.020″-.200″ (0.5-5.0 mm)* ThicknessTolerance ±10% UL Flammability Rating 94 V0 UL Temperature Range −40° C.to 160° C. NA Volume Resistivity 10{circumflex over ( )}13 ohm-cm ASTEMD257 Outgassing TML 0.56% ASTM E595 Outgassing CVCM 0.10% ASTM E595Coefficient Thermal 660 ppm/C IPC-TM-650 Expansion (CTE) 2.4.24

In addition to the examples listed in the tables above, otherthermally-conductive compliant materials or thermally-conductiveinterface materials can also be used for a TIM, which are preferablybetter than air alone at conducting and transferring heat. For example,a TIM may include compressed particles of exfoliated graphite, formedfrom intercalating and exfoliating graphite flakes, such as eGraf™commercially available from Advanced Energy Technology Inc. of Lakewood,Ohio. Such intercalating and exfoliating graphite may be processed toform a flexible graphite sheet, which may include an adhesive layerthereon. Any of the TIMs disclosed herein (e.g., 108, 140, 408, 820,etc.) may comprise one or more of the thermal interface materials (e.g.,graphite, flexible graphite sheet, exfoliated graphite, etc.) disclosedin U.S. Pat. No. 6,482,520, U.S. Pat. No. 6,503,626, U.S. Pat. No.6,841,250, U.S. Pat. No. 7,138,029, U.S. Pat. No. 7,150,914, U.S. Pat.No. 7,160,619, U.S. Pat. No. 7,267,273, U.S. Pat. No. 7,303,820, U.S.Patent Application Publication 2007/0042188, and/or U.S. PatentApplication Publication 2007/0077434.

In various exemplary embodiments, a TIM may include compliant orconformable silicone pads, non-silicone based materials (e.g.,non-silicone based gap filler materials, thermoplastic and/or thermosetpolymeric, elastomeric materials, etc.), silk screened materials,polyurethane foams or gels, thermal putties, thermal greases,thermally-conductive additives, etc. In exemplary embodiments, the TIMmay be configured to have sufficient conformability, compliability,and/or softness to allow the TIM material to closely conform to a matingsurface when placed in contact with the mating surface, including anon-flat, curved, or uneven mating surface. By way of example, someexemplary embodiments include an electrically conductive soft thermalinterface material formed from elastomer and at least onethermally-conductive metal, boron nitride, and/or ceramic filler, suchthat the soft thermal interface material is conformable even withoutundergoing a phase change or reflow. Yet other embodiments includethermal interface phase change material, such as the T-Pcm™ 583 listedin the above table.

In some embodiments, one or more conformable thermal interface materialgap filler pads are used having sufficient deformability, compliance,conformability, compressibility, and/or flexibility for allowing a padto relatively closely conform to the size and outer shape of anelectronic component when placed in contact with the electroniccomponent when the shielding apparatus is installed to a printed circuitboard over the electronic component. By engaging an electronic componentin a relatively close fitting and encapsulating manner, a conformablethermal interface material gap pad may conduct heat away from theelectronic component to the cover in dissipating thermal energy. Also,the thermal interface material gap filler pad may be a non-phase changematerial and/or be configured to adjust for tolerance or gap bydeflecting. Such a thermal interface material gap filler pad would notbe considered to be a spreadable paste.

The following examples, computational modeling, and computational fluiddynamics (CFD) results shown in FIGS. 9, 10, and 11 are merelyillustrative, and do not limit this disclosure in any way. For thisexample, three computations models were created in order to betterunderstand the heat transfer to a device's casing when there isthermally-conductive heat path around a battery and/or battery area ofthe electronic device. For each of the three computational models, itwas assumed that the device casing had a thickness of about 0.625millimeters and a thermal conductivity (k) of 0.14 Watts per meter perKelvin.

FIG. 9 illustrates CFD results showing external temperatures (in degreesCelsius) of an external casing of an electronic device, in which thecomputational model included a thermally-conductive heat path through aBLS around the battery area (and battery therein) in accordance withexemplary embodiments, such as assembly 100 shown in FIG. 1. Generally,FIG. 9 shows that the maximum casing temperature reached 72.7 degreesCelsius when the BLS was disposed about or defined the battery area.

FIG. 10 illustrates CFD results showing external temperatures (indegrees Celsius) of an external casing of an electronic device, in whichthe computational model included a thermally-conductive heat paththrough a TIM around the battery area (and battery therein) inaccordance with exemplary embodiments, such as the assembly 300 shown inFIG. 3. Generally, FIG. 10 shows that the maximum casing temperaturereached 71.7 degrees Celsius when the TIM was disposed about or definedthe battery area.

FIG. 11 illustrates CFD results showing external temperatures in degreesCelsius of an external casing of an electronic device, in which thecomputational model did not include a thermally-conductive heat aroundthe battery area (and battery therein), e.g., battery area 1230 in FIG.12. For the computational model used to obtain the CFD results shown inFIG. 11, it was assumed that the underside of the shield 1210 (FIG. 12)was spaced apart from and positioned 10 mils above the top surface ofthe components 1204 on the PCB 1202. It was also assumed that there wasnot any thermal interface material between the shield 1210 and thecomponents 1204 or between the shield 1210 and the casing 1250.Generally, FIG. 11 shows that the maximum casing temperature reached83.9 degrees Celsius when there was no TIM or BLS disposed about ordefined the battery area (which was higher than the maximum casingtemperatures of 72.7 degrees Celsius shown in FIG. 9 and 71.7 degreesCelsius shown in FIG. 10.

In any one or more of the various embodiments disclosed herein, theshield may comprise a frame and a cover attachable to the frame. Forexample, the cover may include detents for securing the cover to a framethat is mounted on the circuit board, to provide a compressive forcewhen the cover is secured in place over the one or more heat generatingcomponents. The cover may be pressed vertically downward onto the framesuch that at least one locking snap engages and locks into acorresponding opening to thereby engage the cover to the frame. In someembodiments, the cover includes the locking snaps or catches (e.g.,latches, tabs, detents, protuberances, protrusions, ribs, ridges,ramp-ups, darts, lances, dimples, half-dimples, combinations thereof,etc.) with the frame including the corresponding openings (e.g.,recesses, voids, cavities, slots, grooves, holes, depressions,combinations thereof, etc.). In other embodiments, the frame includesthe locking snaps or catches, and the cover includes the correspondingopenings. In still further embodiments, the cover and frame may bothinclude locking snaps or catches for engaging corresponding openings ofthe other component.

By way of example only, FIG. 13 illustrates an exemplary two-pieceshield 1300, which may be used in one or more embodiments disclosedherein. As shown, the shield 1300 includes a frame 1302 and a cover1310. The frame 1302 includes openings 1303. The cover 1310 includesdetents, protrusions or protuberances 1328 configured to be engaginglyreceived (e.g., interlocked or snapped into, etc.) in the correspondingopenings 1303 of the frame 1302. The detents 1328 of the cover 1310 maythus be engaged with the corresponding openings 1303 of the frame 1302,to thereby attach the cover 1310 to the frame 1302 in a latchedposition. In the latched position, a mechanical or clamping force may begenerated that biases the cover 1310 downwardly towards the frame 1302.This biasing force can help provide relatively low thermal impedance bycausing a thermal interface material (e.g., TIM 308 in FIG. 3, TIM 508in FIG. 6, etc.) disposed on the underside of the cover 1310 tocompressively contact against at least a portion of an electroniccomponent (e.g., component 304 FIG. 3, component 504 in FIG. 6, etc.).

Further aspects relate to methods of using EMI shields, TIMs, andassemblies thereof. In one exemplary embodiment, a method is disclosedfor providing heat dissipation from one or more heat generatingcomponents of a board having an EMI shielding and thermal managementassembly that includes a thermally-conductive compliant materialdisposed between the one or more heat generating components and an EMIshielding cover, and a thermally-conductive structure defining two ormore side portions extending upwardly from the topside of the EMIshielding cover, and at least one laterally extending portion that is incontact with the two or more sidewall portions, to define an area orcompartment in which may be received at least a portion of a battery.The method includes contacting one or more heat generating componentswith a thermally-conductive compliant material. The method furtherincludes establishing a thermally-conductive path in contact with thethermally-conductive compliant material, for conducting heat away fromthe underside of the EMI shielding cover and around the area orcompartment via the two or more side portions and the one or morelaterally extending portions to a casing. The method further providesfor dissipating heat generated by the one or more heat generatingcomponents through the thermally-conductive path, to thereby dissipateheat from the one or more heat generating components under the EMIshielding cover through the one or more laterally extending portionsabove the area or compartment to a casing.

Additional aspects of the present disclosure include methods relating toheat dissipation with thermally-conductive heat paths within electronicdevices. In an exemplary embodiment, a method generally includespositioning one or more portions of at least one of an electromagneticinterference (EMI) shield and a thermal interface material relative tothe electronic device, so as to establish a portion of athermally-conductive heat path generally around a battery area betweenan exterior casing and a circuit board of the electronic device. Thethermally-conductive heat path may allow heat transfer from one or moreheat generating components on the circuit board within the electronicdevice to the exterior casing.

Other aspects of the present disclosure include methods relating to theoperation of electronic devices, such as an electronic device thatincludes an exterior casing, a circuit board having one or more heatgenerating components, and a battery area generally between the circuitboard and the exterior casing. In an exemplary embodiment, a methodgenerally includes allowing heat transfer from the one or more heatgenerating components to the exterior casing, along athermally-conductive heat path and a portion thereof generally aroundthe battery area that is defined by one or more portions of at least oneof an electromagnetic interference (EMI) shield and a thermal interfacematerial.

Exemplary embodiments (e.g., 100, 300, 400, 500, 600, 800, 1400, etc.)disclosed herein may be used with a wide range of electronic components,EMI sources, heat-generating components, heat sinks, among others. Byway of example only, exemplary applications include printed circuitboards, high frequency microprocessors, central processing units,graphics processing units, laptop computers, notebook computers, desktoppersonal computers, computer servers, thermal test stands, portablecommunications terminals (e.g., cellular phones, etc.), etc.Accordingly, aspects of the present disclosure should not be limited touse with any one specific type of end use, electronic component, part,device, equipment, etc.

Numerical dimensions and the specific materials disclosed herein areprovided for illustrative purposes only. The particular dimensions andspecific materials disclosed herein are not intended to limit the scopeof the present disclosure, as other embodiments may be sizeddifferently, shaped differently, and/or be formed from differentmaterials and/or processes depending, for example, on the particularapplication and intended end use.

Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”,“lower”, “above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. Spatiallyrelative terms may be intended to encompass different orientations ofthe device in use or operation in addition to the orientation depictedin the figures. For example, if the device in the figures is turnedover, elements described as “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the example term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting. As usedherein, the singular forms “a”, “an” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. The terms “comprises,” “comprising,” “including,” and“having,” are inclusive and therefore specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The method steps, processes, and operations described hereinare not to be construed as necessarily requiring their performance inthe particular order discussed or illustrated, unless specificallyidentified as an order of performance. It is also to be understood thatadditional or alternative steps may be employed.

When an element or layer is referred to as being “on”, “engaged to”,“connected to” or “coupled to” another element or layer, it may bedirectly on, engaged, connected or coupled to the other element orlayer, or intervening elements or layers may be present. In contrast,when an element is referred to as being “directly on,” “directly engagedto”, “directly connected to” or “directly coupled to” another element orlayer, there may be no intervening elements or layers present. Otherwords used to describe the relationship between elements should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” etc.). As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Although the terms first, second, third, etc. may be used herein todescribe various elements, components, regions, layers and/or sections,these elements, components, regions, layers and/or sections should notbe limited by these terms. These terms may be only used to distinguishone element, component, region, layer or section from another region,layer or section. Terms such as “first,” “second,” and other numericalterms when used herein do not imply a sequence or order unless clearlyindicated by the context. Thus, a first element, component, region,layer or section discussed below could be termed a second element,component, region, layer or section without departing from the teachingsof the example embodiments.

Example embodiments are provided so that this disclosure will bethorough, and will fully convey the scope to those who are skilled inthe art. Numerous specific details are set forth such as examples ofspecific components, devices, and methods, to provide a thoroughunderstanding of embodiments of the present disclosure. It will beapparent to those skilled in the art that specific details need not beemployed, that example embodiments may be embodied in many differentforms and that neither should be construed to limit the scope of thedisclosure. In some example embodiments, well-known processes,well-known device structures, and well-known technologies are notdescribed in detail.

The disclosure herein of particular values and particular ranges ofvalues for given parameters are not exclusive of other values and rangesof values that may be useful in one or more of the examples disclosedherein. Moreover, it is envisioned that any two particular values for aspecific parameter stated herein may define the endpoints of a range ofvalues that may be suitable for the given parameter. The disclosure of afirst value and a second value for a given parameter can be interpretedas disclosing that any value between the first and second values couldalso be employed for the given parameter. Similarly, it is envisionedthat disclosure of two or more ranges of values for a parameter (whethersuch ranges are nested, overlapping or distinct) subsume all possiblecombination of ranges for the value that might be claimed usingendpoints of the disclosed ranges.

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the invention. Individual elements or features ofa particular embodiment are generally not limited to that particularembodiment, but, where applicable, are interchangeable and can be usedin a selected embodiment, even if not specifically shown or described.The same may also be varied in many ways. Such variations are not to beregarded as a departure from the invention, and all such modificationsare intended to be included within the scope of the invention.

1. An assembly suitable for use in dissipating heat from one or moreheat generating components of a circuit board within an electronicdevice that includes an exterior casing and a battery area between thecircuit board and the exterior casing, the assembly comprising athermally-conductive structure which comprises elastomer and is disposedabout or defining the battery area such that a thermally-conductive heatpath is provided from the one or more heat generating components aroundthe battery area to the exterior casing, the thermally-conductive heatpath including a portion around a battery positioned within the batteryarea provided by the thermally-conductive structure, such that heat istransferrable through the thermally-conductive structure and along thethermally-conductive heat path from the one or more heat generatingcomponents around the battery area to the exterior casing.
 2. Theassembly of claim 1, wherein the elastomer is filled withthermally-conductive materials formed from at least onethermally-conductive metal, boron nitride, ceramic filler, and/orparticles of intercalated and exfoliated graphite flakes.
 3. Theassembly of claim 1, wherein the thermally conductive structurecomprises a core body of high conductivity metal or metal alloy havingopposite sides along which is disposed thermal interface material formounting against the exterior casing and for mounting against the one ormore heat generating components, the thermal interface materialincluding one or more of phase change material, thermal grease, and/orgap filler.
 4. The assembly of claim 1, wherein the thermally conductivestructure has a Shore 00 hardness of from about 25 to about
 75. 5. Theassembly of claim 1, wherein the thermally conductive structurecomprises: a thermal interface material gap filler including boronnitride filled silicone elastomer having a Shore 00 hardness of fromabout 25 to about 75 and/or configured to recover to over 90% of itsoriginal thickness after compression under low pressure of 10 to 100pounds per square inch; and/or a thermal interface material gap fillerincluding silicone elastomer filled with thermally-conductive materialsand having a Shore 00 hardness of about 27 and/or configured to deflectto over 50% of its original thickness at a pressure of 50 pounds persquare inch; and/or non-reinforced phase change material having a phasechange softening temperature of 122 degrees Fahrenheit; and/or asilicone-based thermal grease having a viscosity of less than 1,500,000centipoises.
 6. The assembly of claim 1, wherein the thermallyconductive structure is configured with sufficient conformability toallow the thermally conductive structure to closely conform to a matingsurface when placed in contact with the mating surface, including anon-flat, curved, or uneven mating surface.
 7. The assembly of claim 1,wherein the thermally-conductive structure is wrapped about the batteryfor the electronic device.
 8. The assembly of claim 1, wherein thethermally conductive structure comprises thermally and electricallyconductive elastomer.
 9. The assembly of claim 1, further comprising anelectromagnetic interface (EMI) shield configured to be disposed overthe one or more heat generating components to provide EMI shielding tothe one or more heat generating components.
 10. The assembly of claim 9,wherein the thermally conductive structure includes: a first thermalinterface material between the EMI shield and the one or more heatgenerating components such that an air gap separates the EMI shield fromthe first thermal interface material, which is in contact with the oneor more heat generating components; and a second thermal interfacematerial in contact with the exterior casing and the first thermalinterface material such that heat is transferrable through the first andsecond thermal interface materials along the thermally-conductive heatpath from the one or more heat generating components around the batteryarea to the exterior casing.
 11. An electronic device comprising: acircuit board including one or more heat generating components; anexterior casing; a battery area between the circuit board and theexterior casing; an electromagnetic interference (EMI) shielding/thermalinterface material positioned relative to the one or more heatgenerating components to provide EMI shielding to the one or more heatgenerating components; and a thermally-conductive heat path at leastpartially defined by the EMI shielding/thermal interface material fromthe one or more heat generating components to the exterior casing, thethermally-conductive heat path including a portion around the batteryarea that is defined by one or more portions of the EMIshielding/thermal interface material, such that heat is transferrablethrough the EMI shielding/thermal interface material and along thethermally-conductive heat path from the one or more heat generatingcomponents around the battery area to the exterior casing.
 12. Theelectronic device of claim 11, wherein the EMI shielding/thermalinterface material comprises thermally and electrically conductiveelastomer.
 13. The electronic device of claim 11, further comprising abattery within the battery area about which is wrapped at least aportion of the EMI shielding/thermal interface material, such that theat least one wrapped portion of the EMI shielding/thermal interfacematerial defines the portion of the thermally-conductive heat patharound the battery area.
 14. The electronic device of claim 11, whereinthe EMI shielding/thermal interface material comprises elastomer filledwith thermally-conductive materials formed from at least onethermally-conductive metal, boron nitride, ceramic filler, and/orparticles of intercalated and exfoliated graphite flakes.
 15. Theelectronic device of claim 11, wherein the EMI shielding/thermalinterface material has a Shore 00 hardness of from about 25 to about 75.16. The electronic device of claim 11, wherein the EMI shielding/thermalinterface material comprises a core body of high conductivity metal ormetal alloy having opposite sides along which is disposed thermalinterface material for mounting against the exterior casing and formounting against the one or more heat generating components, the thermalinterface material including one or more of phase change material,thermal grease, and/or gap filler.
 17. The electronic device of claim11, wherein the EMI shielding/thermal interface material comprises: athermal interface material gap filler including boron nitride filledsilicone elastomer having a Shore 00 hardness of from about 25 to about75 and/or configured to recover to over 90% of its original thicknessafter compression under low pressure of 10 to 100 pounds per squareinch; and/or a thermal interface material gap filler including siliconeelastomer filled with thermally-conductive materials and having a Shore00 hardness of about 27 and/or configured to deflect to over 50% of itsoriginal thickness at a pressure of 50 pounds per square inch; and/ornon-reinforced phase change material having a phase change softeningtemperature of 122 degrees Fahrenheit; and/or a silicone-based thermalgrease having a viscosity of less than 1,500,000 centipoises.
 18. Theelectronic device of claim 11, wherein the EMI shielding/thermalinterface material is configured with sufficient conformability to allowthe thermally conductive structure to closely conform to a matingsurface when placed in contact with the mating surface, including anon-flat, curved, or uneven mating surface.
 19. The electronic device ofclaim 11, further comprising an electromagnetic interface (EMI) shielddisposed over the one or more heat generating components to provide EMIshielding to the one or more heat generating components.
 20. Theelectronic device of claim 19, wherein the EMI shielding/thermalinterface material comprises: a first thermal interface material betweenthe EMI shield and the one or more heat generating components such thatan air gap separates the EMI shield from the first thermal interfacematerial, which is in contact with the one or more heat generatingcomponents; and a second thermal interface material in contact with theexterior casing and the first thermal interface material such that heatis transferrable through the first and second thermal interfacematerials along the thermally-conductive heat path from the one or moreheat generating components around the battery area to the exteriorcasing.
 21. A method relating to heat dissipation with athermally-conductive heat path within an electronic device for allowingheat transfer from one or more heat generating components on a circuitboard within the electronic device to an exterior casing of theelectronic device, the method comprising positioning athermally-conductive structure which comprises elastomer to establish athermally-conductive heat path around a battery area for receiving abattery for the electronic device between the exterior casing and thecircuit board of the electronic device, such that heat may betransferred through the thermally-conductive structure which compriseselastomer and along the thermally-conductive heat path from the one ormore heat generating components around the battery area to the exteriorcasing.
 22. The method of claim 21, wherein the positioning includeswrapping the thermally conductive structure which comprises elastomeraround the battery for the electronic device.
 23. The method of claim22, further comprising inserting the battery into the battery area ofthe electronic device after the wrapping.
 24. The method of claim 21,wherein the thermally conductive structure comprises a core body of highconductivity metal or metal alloy having opposite sides along which isdisposed thermal interface material for mounting against the exteriorcasing and for mounting against the one or more heat generatingcomponents, the thermal interface material including one or more ofphase change material, thermal grease, and/or gap filler.